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Localized high-resolution stress measurements on MEMS structures

: Vogel, D.; Gollhardt, A.; Michel, B.


American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division:
ASME InterPack Conference 2009. Proceedings. Vol.1 : Presented at 2009 ASME InterPack Conference, July 19 - 23, 2009, San Francisco, California, USA
New York/NY.: ASME, 2010
ISBN: 0-7918-4359-9
ISBN: 978-0-7918-4359-8
InterPack Conference (IPACK) <2009, San Francisco/Calif.>
Conference Paper
Fraunhofer ENAS ()
Fraunhofer IZM ()

Three different methods of stress measurement with strong spatial resolution are presented. They base on stress relief techniques caused by focused ion beam milling, on altered electron backscattering by deformed lattices and on Stokes line shift measurements by Raman spectroscopy. The capability of these methods is demonstrated by their application to typical MEMS structures. A comparison between the methods is performed in order to outline potentials and limitations.