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Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect

 
: Klein, A.; Gerritzen, A.; Schröder, H.; Oppermann, H.; Capello, D.; Pallaro, N.

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Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
pp.738-743
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this paper we present the design and fabrication of a low cost surface mountable planar optical interconnect and the integration in a low-cost multifunctional and mUltispectral CMOS vision sensor (MFOS) to detect critical environmental parameters (fog, rain, twilight) providing, at the same time, information on the driving scenario (oncoming vehicles, VRUs in night conditions). The project ADOSE addresses research challenges in the area of accident prevention; the focus is on functional, performance and cost limits of current sensors and Advanced Driver Assistance Systems for their extensive market penetration. The 3D structure of the interconnect makes it possible to guide collimated light to dedicated detection regions on a CMOS imager, thus making a virtual partition of the sensitive imager area in sub-areas, usually not needed by the applications requiring the frontal view monitoring, possible. Therefore one imager chip can be used for several sensing and imaging functions. The optical system can be passively assembled and is surface mountable resulting in low cost fabrication.

: http://publica.fraunhofer.de/documents/N-188586.html