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Yield model for estimation of yield impact of semiconductor manufacturing equipment

: Nutsch, A.; Oechsner, R.; Schoepka, U.; Pfitzner, L.

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE Eighteenth International Symposium on Semiconductor Manufacturing, ISSM 2010. Conference Proceedings : 18-20 Oct. 2010, Tokyo, Japan
New York, NY: IEEE, 2010
ISBN: 978-1-4577-0392-8
ISBN: 978-1-4577-0392-8
4 pp.
International Symposium on Semiconductor Manufacturing (ISSM) <18, 2010, Tokyo>
Conference Paper
Fraunhofer IISB ()

A yield model was developed allowing the calculation of yield using defect density data of manufacturing equipment. The approach allows studying impact of semiconductor manufacturing equipment on yield, to calculate and monitor yield during semiconductor manufacturing and predicting yield based on real time input of semiconductor manufacturing equipment regarding failures, defect density etc. The yield model bases on generic flows of manufacturing processes. The model assigns each functional layer a yield loss during the sequence of manufacturing steps. The yield model was implemented in a software code. The software was used to study yield impact of specific equipment for different technologies and products.