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fibDAC stress relief - A novel stress measurement approach for BEoL structures

: Vogel, D.; Michel, B.


Zschech, E. ; American Institute of Physics -AIP-, New York:
Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization 2010 : Bad Schandau, Germany, 12 - 14 April 2010
Woodbury, N.Y.: AIP, 2010 (AIP Conference Proceedings 1300)
ISBN: 978-0-7354-0855-5
ISSN: 0094-243X
International Workshop on Stress-Induced Phenomena in Metallization <11, 2010, Bad Schandau>
Conference Paper
Fraunhofer ENAS ()

fibDAC stress relief is a new method developed to measure stresses on micro and nanotechnology devices. Focused Ion Beam (FIB) milling is used to remove locally material and release this way stresses. Cross correlation algorithms on high resolution SEM images captured before and after ion milling reveal stress relief deformations. Their analysis allows computation of stresses present at the place of ion milling. Thorough qualification of the approach resulted in a stress measurement accuracy of 1-510-4E, where E is the Young's modulus of the material tested. Lateral resolution of stresses can be reduced to a value around 200 ... 500 nm.