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Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation

: May, D.; Wunderle, B.; Schacht, R.; Michel, B.

Institute of Electrical and Electronics Engineers -IEEE-; Circuits Multi-Projets -CMP-, Grenoble; IEEE Components, Packaging, and Manufacturing Technology Society:
THERMINIC 2009, 15th International Workshop on Thermal Investigations of ICs and Systems : Leuven, Belgium, 7 - 9 October 2009
New York, NY: IEEE, 2010
ISBN: 978-1-4244-5881-3
ISBN: 978-2-35500-010-2
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <15, 2009, Leuven>
Conference Paper
Fraunhofer IZM ()

Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be presented. It is now possible to have further investigation in material class of polymers, which is very important in the field of system integration. First promising results will be presented.