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Low-creep metallic thin films and reflective coatings for optical microsystems

: Schmidt, J.U.; Knobbe, J.; Gehner, A.


Plasma Processes and Polymers 4 (2007), Supplement 1, pp.S49-S52
ISSN: 1612-8850
ISSN: 1612-8869
Journal Article
Fraunhofer IPMS ()

The large-scale integration of analog operable MEMS micromirrors onto active CMOS address circuitry involves several challenges. Mirror actuators must be fabricated using CMOS compatible technology, exhibit highly reflecting planar optical surfaces, and stable analog deflection-voltage characteristics not compromised by drift or creep effects. CMOS integration imposes strict limits depending on the range of available materials and the restricted temperature budget. Highly elastic materials such as single-crystalline Si or poly-SiGe have been integrated by layer transfer bonding or PECVD deposition, respectively. In this paper, a novel approach, i.e., the low-temperature monolithic integration of creep-resistant all-sputtered glassy TiAl mirror actuators with Al reflective coating is presented.