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Flying Wafer - A standardised methodology for multi-site processing of 300 mm wafers at R&D-sites

: Frickinger, J.; Oechsner, R.; Schellenberger, M.; Pfeffer, M.; Pfitzner, L.; Ryssel, H.; Claeys, C.; Claes, M.; Bearda, T.; Renaud, D.; Danel, A.; Lering, M.; Graef, M.; Kaushik, V.; Murphy, B.; Fritzsche, M.; Walther, H.; Hury, S.

Dolgui, A. ; International Federation of Automatic Control -IFAC-; International Federation of Operational Research Societies -IFORS-; Institute of Electrical and Electronics Engineers -IEEE-; Ecole Nationale Superieure des Mines de Saint-Etienne:
12th IFAC Symposium on Information Control Problems in Manufacturing, INCOM' 2006. Vol.2: Industrial Engineering : Preprints, May 17-19, 2006, Saint-Etienne, France
Saint-Etienne, France, 2006
ISBN: 0-08-044654-X
ISBN: 978-0-08-044654-7
Symposium on Information Control Problems in Manufacturing (INCOM) <12, 2006, Saint-Etienne>
Conference Paper
Fraunhofer IISB ()

FLYING WAFER was a joint European project funded in the 6th Framework of the European Commission. The objective was to provide a methodology for interlinking European R&D centres in micro- and nanotechnologies to a distributed 300 mm CMOS R&D line. The FLYING WAFER project was carried out as a feasibility study. Therefore, the results provided a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multi-site processing.