Flying Wafer - A standardised methodology for multi-site processing of 300 mm wafers at R&D-sites

FLYING WAFER was a joint European project funded in the 6th Framework of the European Commission. The objective was to provide a methodology for interlinking European R&D centres in micro- and nanotechnologies to a distributed 300 mm CMOS R&D line. The FLYING WAFER project was carried out as a feasibility study. Therefore, the results provided a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multi-site processing.