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Packaging technology of multi deflection arrays for multi-shaped beam lithography

: Burkhardt, T.; Mohaupt, M.; Hornaff, M.; Zaage, B.; Beckert, E.; Döring, H.-J.; Slodowski, M.; Reimer, K.; Witt, M.; Eberhardt, R.; Tünnermann, A.

International Microelectronics and Packaging Society -IMAPS-:
IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.2 : Long Beach, California, USA, 9 - 13 October 2011
Red Hook, NY: Curran, 2012
ISBN: 978-1-618-39850-5
International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>
Conference Paper
Fraunhofer IOF ()
Fraunhofer ISIT ()
multi-shaped beam lithography; electron beam lithography; MEMS Assembly; solderjet bumping; laser soldering; hybrid packaging

Multi-Shaped electron beam lithography is considered a promising approach for high throughput mask and direct writing. Providing multiple apertures and individually controlled electrodes it allows for massive parallelization of exposure shots, thus significantly decreasing write time. A silicon-based micro-structured MEMS multi-beam deflection array (MDA) featuring 8x8 apertures is presented. The hybrid integration of MDA devices in ceramic system carries utilizing a laser-based Solderjet Bumping process is demonstrated. This flux-free soldering process provides adhesive-free, long term stable and vacuum compatible joints and is used for both mechanical fixation and electrical connection. Electron beam deflection in two perpendicular directions requires the highly accurate placement of two crossed MDA devices, which is carried out by three degrees of freedom alignment procedures and solder joining. Electrical signal routing within the electron optical column using flexible printed circuit boards and flux-free soldering is also reported. The precision adjustment of two carriers is accomplished by fiducial mark detection using image processing. Results on alignment accuracy in the sub-micron range, mechanical and electrical testing of such assemblies are reported.