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Modelling of contact regimes in wire sawing with dissipative particle dynamics

: Bierwisch, C.; Kübler, R.; Kleer, G.; Moseler, M.

Preprint urn:nbn:de:0011-n-1811939 (864 KByte PDF)
MD5 Fingerprint: 4c60c2122eea6fa5cc522646cb161b0f
Created on: 23.4.2013

Philosophical Transactions of the Royal Society of London. Series A 369 (2011), No.1945, pp.2422-2430
ISSN: 0080-4614
ISSN: 0962-8428
ISSN: 1364-503X
ISSN: 0264-3820
ISSN: 1471-2962
Journal Article, Electronic Publication
Fraunhofer IWM ()

Optimization of the wire sawing process of silicon ingots requires a profound understanding of the dynamic interaction of wire, slurry and silicon material. In this paper, the influence of wire velocity and applied wire stress on the process is investigated using dissipative particle dynamics and discrete element simulations for modelling the fluid and the grains in the abrasive suspension. In our simulations, different contact regimes occur depending on grain shape and a stress balance within the system. We observed semi-contact for high wire stress and low wire velocity and non-contact for low stress and high velocities in agreement with predictions from elasto-hydrodynamic modelling. Our simulations suggest the usage of sharp grains, since in this case, stress localization on the base of the sawing groove occurs even in the non-contact regime. These insights are likely to provide a scientific base for the optimization of sawing rates and reduction of kerf loss.