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Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds

 
: Shirangi, M.H.; Michel, B.

:

Fan, X.-J. ; Micro- and opto-electronic materials, structures, and systems:
Moisture sensitivity of plastic packages of IC devices
Berlin: Springer, 2010
ISBN: 978-1-441-95718-4
ISBN: 978-1-441-95719-1 (e-book)
pp.29-69
English
Book Article
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/documents/N-177550.html