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Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds
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2010
Book Article
Titel
Mechanism of moisture diffusion, hygroscopic swelling, and adhesion degradation in epoxy molding compounds
Author(s)
Shirangi, M.H.
Michel, Bernd
Hauptwerk
Moisture sensitivity of plastic packages of IC devices
DOI
10.1007/978-1-4419-5719-1_2
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS