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Development of innovative particleboard panels

 
: Balducci, F.; Harper, C.; Meinlschmidt, P.; Dix, B.; Sanasi, A.

Drvna Industrija 59 (2008), No.3, pp.131-136
ISSN: 0012-6772
English
Journal Article
Fraunhofer WKI ()

Abstract
One aim of a joint European project called DIPP (Development of Innovative Particleboard (chipboard) Panels for a better mechanical performance and a lower environmental impact) is the development of lightweight particleboards made from annual/perennial farm plants such as hemp, sunflower, topinambur, maize and miscanthus. These lightweight particleboards are intended as a possible substitution for traditional wood-based particleboards used in the furniture industry. Therefore the requirements of the EN 312 concerning the moisture-related and mechanical properties of boards for interior use have to be met. The results of research have shown that the internal bond strength of one-layer lightweight particleboards made in the experiment meets the requirements of EN 312 (type P2) and the internal bond strength of three-layer boards with topinambur in the core layer does not meet these requirement. The lightweight boards failed to meet the requirements of modulus of elastici ty and bending strength.

: http://publica.fraunhofer.de/documents/N-173441.html