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Innovative packaging concepts for ultrathin ICs

 
: Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.

Semiconductor international 26 (2003), No.11, pp.SP-9-SP-15
ISSN: 0163-3767
English
Journal Article
Fraunhofer IZM-M

Abstract
The advantages of ultrathin integrated circuits (IC) in the various fields of microelectronics are discussed. Ultrathin ICs offer new and advantageous assembly techniques for packaging. Their low thickness permits new wafer separation methods with enhanced flexibility and fracture strength. Low topography of mounted thin chips offers direct integration in substrate manufacturing with both thin- and thick-film technology. Ultrathin chips also support reel-to-reel manufacturing with foils or paper as substrate due to their flexibility.

: http://publica.fraunhofer.de/documents/N-173218.html