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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Numerical and experimental investigations of large IC flip chip attach

: Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.

	Electronic Components, Assemblies, and Materials Association; IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2000. Proceedings of the 50th Electronic Components & Technology Conference : May 21 - 24, 2000, Las Vegas, Nevada, USA Piscataway, NJ, USA: IEEE Press, 2000 ISBN: 0-7803-5908-9 ISBN: 0-7803-5909-7 ISBN: 0-7803-5910-0 ISBN: 0-7803-5911-9 pp.1338-1346
	Electronic Components and Technology Conference (ECTC) <50, 2000, Las Vegas/Nev.>

	English
	Conference Paper
	Fraunhofer IZM ()

Abstract
A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.