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Overview and development trends in the field of MEMS packaging

 
: Reichl, H.; Grosser, V.

:

Micro Electro Mechanical Systems, MEMS 2001 : 21 Jan 2001 - 25 Jan 2001, Interlaken
Piscataway, NJ: IEEE, 2001
ISBN: 0-7803-5998-4
pp.1-5
IEEE International Conference on Micro Electro Mechanical Systems (MEMS) <14, 2001, Interlaken>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Packing techniques used in micro electro mechanical systems (MEMS) for bumping were described. The chip size package (CSP) technology was used to mount the chip on top of a multilayer interposer. An ultra thin chip was assembled on the base chip and the connection between base and thinned chip was carried out by a rewiring technology. Cubic integration by stacking of CSP packaged MEMS modules contributed to an economic realization of low volume microsystems.

: http://publica.fraunhofer.de/documents/N-173184.html