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2001
Conference Paper
Titel
Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Abstract
The application of AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules using a high accuracy flip-chip bonder was investigated. The different requirements of the modules were matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters. The -phase contact was obtained under Au80Sn20 reflow conditions. Working with -phase offers the possibility to work with the fluxfree Au80Sn20 metallurgy on different assembly levels of optoelectronic modules without remelting the interconnections soldered at previous assembly steps.