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Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules

 
: Elger, G.; Voigt, J.; Oppermann, H.

IEEE Lasers and Electro-Optics Society:
LEOS 2001. The 14th Annual Meeting of the IEEE Lasers & Electro-Optics Society. Vol.2 : Hyatt Regency La Jolla, San Diego, CA. 2001 IEEE/LEOS annual meeting conference proceedings
Piscataway, NJ: IEEE, 2001
ISBN: 0-7803-7105-4
ISBN: 0-7803-7106-2
pp.437-438
IEEE Lasers and Electro-Optics Society (Annual Meeting) <14, 2001, San Diego/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The application of AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules using a high accuracy flip-chip bonder was investigated. The different requirements of the modules were matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters. The -phase contact was obtained under Au80Sn20 reflow conditions. Working with -phase offers the possibility to work with the fluxfree Au80Sn20 metallurgy on different assembly levels of optoelectronic modules without remelting the interconnections soldered at previous assembly steps.

: http://publica.fraunhofer.de/documents/N-173183.html