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Modular systems for sensor integration

: Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
International Symposium on Microelectronics 2002. Proceedings : September 4 - 6, 2002, Colorado Convention Center, Denver, CO
Washington, DC: IMAPS, 2002 (SPIE Proceedings Series 4931)
ISBN: 0-930815-66-1
International Symposium on Microelectronics <35, 2002, Denver/Colo.>
Conference Paper
Fraunhofer IZM ()

A concept for the integration of sensors was developed. Prototypes were built up applying conventional stencil printing and pick and place equipment. The feasibility to manufacture the modular FR-4 package was demonstrated in phase 1 and reliability tests did not reveal significant degradation of the measured resistance values. The experiments conducted during phase 2 proved the feasibility to assemble chips with 300 m pitch using COB or FC technology, respectively.