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Packaging technologies for flexible systems

 
: Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
International Conference on Advanced Packaging and Systems 2002. Proceedings : March 10 - 13, 2002, Reno Hilton Hotel, Reno, Nevada
Washington: IMAPS, 2002 (SPIE Proceedings Series 4828)
ISBN: 0-930815-65-3
ISBN: 0-8194-4595-9
pp.43-45
International Conference on Advanced Packaging and Systems (ICAPS) <2002, Reno/Nev.>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-173169.html