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Area array contacts to assemble a 3D transfomer for a miniaturized voltage converter

 
: Jung, E.; Kolesnik, I.; Becker, K.F.; Aschenbrenner, R.; Reichl, H.

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium
2004
ISBN: 0-7803-8582-9
ISBN: 0-7803-8583-7
pp.309-313
International Electronics Manufacturing Technology Symposium (IEMT) <29, 2004, San Jose/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Miniaturization is often targeting only individual aspects of a system, e.g. making specific components smaller. A more successful approach is trying to employ synergetic engineering to minimize not only individual components but targets to system as such and uses a top down methodology to minimize the size of a complex product. For the described application, a miniaturized voltage converter, several miniaturization approaches have been merged with 3D assembly technology and flex substrates in order to achieve a target size of 1cm3. Bare die assembly, an innovative approach to wire the coils utilizing advanced PCB technology, a product specific magnetic ferrite core and area array assembly techniques with reflow encapsulant and finally flex substrates which are folded into the final shape are utilized to realize the product demonstrator. All aspects of the technology were verified against manufacturing capabilities of a medium sized company, allowing them to fabricate t he device for the use in today's mobile products.

: http://publica.fraunhofer.de/documents/N-173137.html