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Modelling and application of silicon microphone systems

 
: Mammen, H.-T.; Stürmer, U.; Koch, M.; Köhne, H.; Becker, K.-F.; John, W.; Reichl, H.

Toh, K.C. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section; IEEE Components, Packaging, and Manufacturing Technology Society; International Microelectronics and Packaging Society -IMAPS-:
6th Electronics Packaging Technology Conference, EPTC 2004. Proceedings : 8 - 10 December 2004, Pan Pacific Hotel, Singapore
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8821-6
ISBN: 0-7803-8822-4
pp.183-188
Electronics Packaging Technology Conference (EPTC) <6, 2004, Singapore>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The modelling procedure described in this publication which is based on a partitioning of the total structure, allows a synthesis of the overall transfer function from simple, physics-motivated equations representing the behaviour of the substructures. Casting this into a Matlab description admits relatively easy combination with a GUI in order to obtain a modelling environment convenient for parameter studies during the development process. In parallel, some package solution for single-chip and array microphones are developed. During the model development it is not possible to consider all kinds of applications taking into account, so that some effects occur first at the finished product. Especially in a car application (handsfree set) for mobile phones occurred parasitic EMC effects. Based on this example, the EMC problems are described and solutions for circuit- as well as for package-level are presented.

: http://publica.fraunhofer.de/documents/N-173136.html