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Biocompatible hybrid system integration of silicon based neural interface devices

 
: Tathireddy, P.; Chakravarthy, S.; Hsu, J.; Klein, M.; Oppermann, H.; Rieth, L.; Harrison, R.; Normann, R.A.; Solzbacher, F.

Laudon, M. ; Nano Science and Technology Institute -NSTI-:
NSTI Nanotechnology Conference and Trade Show 2006. Vol.3 : NSTI Nanotech 2006; May 7 - 11, 2006, Hynes Convention Center, Boston, Massachusetts, U.S.A.; An interdisciplinary integrative forum on nanotechnology, biotechnology and microtechnology
Cambridge, Mass. [u.a.]: NSTI, 2006
ISBN: 0-9767985-6-5
ISBN: 0-9767985-9-X
pp.357-360
Nanotechnology Conference and Trade Show (Nanotech) <9, 2006, Boston/Mass.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Chronically implantable wireless neural interface devices require biocompatible and stable high density integration of several components such as sensing elements, data processors, communication, and power supply coils. Biocompatible integration technology has been developed for Utah Electrode Array (UEA) based implantable neural interface devices. These interface devices comprise: silicon based UEA as sensing element; data processing integrated circuit; surface mounted devices (SMD); inductive power supply and communication coil made of Au and polyimide. Biocompatible materials are used in the flipchip bonding of the components to form a stacked hybrid assembly. In the final step of the device fabrication, the assembled device is coated with SiC and ParyleneC to provide insulating, hermitic, and biocompatible encapsulation. The encapsulation is etched on the sensing tips of the electrodes.

: http://publica.fraunhofer.de/documents/N-173074.html