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FIB-based technique for stress characterization on thin films for reliability purposes

: Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B.


Microelectronic engineering 84 (2007), No.5-8, pp.1783-1787
ISSN: 0167-9317
Journal Article
Fraunhofer IZM ()

This paper describes a novel approach of stress measurement based on the combined imaging-milling capabilities of a FIB equipment. This technique consists on the scaling down of two measurement techniques based on stress-relaxation, the slot and the hole-drilling methods. The main aspects of both approaches at a microscale are described and illustrated and some examples of their application to thin films are presented.