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3D capacitive interconnections with mono- and Bi-directional capabilities

 
: Fazzi, A.; Canegallo, R.; Ciccarelli, L.; Magagni, L.; Natali, F.; Jung, E.; Rolandi, P.L.; Guerrieri, R.

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Institute of Electrical and Electronics Engineers -IEEE-:
International Solid-State Circuits Conference, ISSCC 2007. Digest of Technical Papers : San Francisco, CA, February 11 - 15, 2007
New York, NY: IEEE, 2007
ISBN: 1-4244-0853-9
pp.356-608
International Solid State Circuits Conference (ISSCC) <54, 2007, San Francisco/Calif.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13m CMOS and assembled face-to-face. RX-TX circuits are connected by 8×8m2 electrodes and this enables the vertical propagation of clock at 1.7GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/m 2with 0.08pJ/b energy consumption.

: http://publica.fraunhofer.de/documents/N-173060.html