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Heterogeneous integration: The bridge between micro/nanoelectronics and application

 
: Aschenbrenner, R.

:

Keyun, B. ; Institute of Electrical and Electronics Engineers -IEEE-; China Electronic Packaging Society:
7th International Conference on Electronics Packaging Technology 2006 : Shanghai, China, August 26 to 29, 2006
Piscataway, NJ: IEEE Operations Center, 2006
ISBN: 1-424-40619-6
ISBN: 1-424-40620-X
Art. 4199027
International Conference on Electronics Packaging Technology (ICEPT) <7, 2006, Shanghai>
English
Conference Paper
Fraunhofer IZM ()

: http://publica.fraunhofer.de/documents/N-173058.html