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Singular value based model order reduction for interconnect ARX modelling



Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electromagnetic Compatibility Society:
IEEE International Symposium on Electromagnetic Compatibility, EMC 2007 : 9 - 13 July 2007, Honolulu, Hawaii
Piscataway, NJ: IEEE Operations Center, 2007
ISBN: 1-424-41349-4
ISBN: 1-424-41350-8
Art. 4305730
IEEE International Symposium on Electromagnetic Compatibility (EMC) <2007, Honolulu/Hawaii>
Conference Paper
Fraunhofer IZM ()

This paper presents the abstract modelling of packages and high density interconnections, in order to build a behavioral model knowing very few information. The approach is based on combining black box modelling and order reduction. The package is divided into single block models that are defined from arbitrary input and output signals. Using black box modelling numerically effective simulations of the interconnection is possible. Balanced form of high order model of interconnection can be easily reduced. The dominant states essential for the order reduction procedure are recognized in the model singular values issued from the observability and the controllability Gramians. On this way a efficient signal integrity analysis can be fast and easily achieved.