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Stacking of ultra-thin film packages

 
: Ko, C.-T.; Shih, Y.-C.; Chang, J.-Y.; Kuo, T.-Y.; Chen, Y.-H.; Ostmann, A.; Manessis, D.

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Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.1 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 1-4244-2813-0
ISBN: 978-1-4244-2814-4
pp.125-130
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper brings into light a new ultra-thin and highly flexible package with embedded active chips. In this technology, no supporting and permanent substrates were needed. Copper foil was used as temporal substrate, and it became the bottom circuit after patterning and etching processes. Ultra-thin chips with 20-25m thickness were assembled directly on the structured copper foils in a flip-chip fashion. The gap between chip and copper foil was only about 10m. Subsequently, the chips were embedded into flexible adhesive/polyimide polymer layers or alternatively in highly elastic polyurethane materials, with a copper foil always laminated on the top. The resultant ultra-thin film package (UTFP) has a thickness of 100m only. Each package sticking on a rod with 10mm diameter could pass the electrical measuring. Stacking of three-layer chip embedded packages had also been realized and passed electrical measurements. The process details on each core technique will be disclo sed, and some results will be presented in the paper. ©2008 IEEE.

: http://publica.fraunhofer.de/documents/N-173018.html