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Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology

: Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.


Gallium Arsenide Application Symposium Association -GAAS-; Institute of Electrical and Electronics Engineers -IEEE-; European Microwave Association:
3rd European Microwave Integrated Circuits Conference 2008. Proceedings : Held in Amsterdam, from 27 to 31 October 2008 as part of European Microwave Week 2008, EuMW
New York, NY: IEEE, 2008
ISBN: 978-2-87487-007-1
European Microwave Integrated Circuits Conference (EuMIC) <3, 2008, Amsterdam>
Conference Paper
Fraunhofer IZM ()

This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.