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2008
Conference Paper
Titel
"glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
Abstract
The "glassPack"-concept will be introduced as a new packaging technologies platform for a wide area of optoelectronic applications like optical backplane, electricaloptical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.