Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology

: Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.


European Microwave Association:
38th European Microwave Conference, 2008, EuMC 2008. Conference Proceedings : 27 - 31 October 2008, Amsterdam, Netherlands
Piscataway, NJ: IEEE, 2008
ISBN: 978-2-87487-006-4
ISBN: 978-1-4244-3794-8
ISBN: 978-2-87487-005-7
European Microwave Conference (EuMC) <38, 2008, Amsterdam>
Conference Paper
Fraunhofer IZM ()

This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.