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Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology

 
: Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.

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European Microwave Association:
38th European Microwave Conference, 2008, EuMC 2008. Conference Proceedings : 27 - 31 October 2008, Amsterdam, Netherlands
Piscataway, NJ: IEEE, 2008
ISBN: 978-2-87487-006-4
ISBN: 978-1-4244-3794-8
ISBN: 978-2-87487-005-7
pp.1573-1576
European Microwave Conference (EuMC) <38, 2008, Amsterdam>
English
Conference Paper
Fraunhofer IZM ()

Abstract
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.

: http://publica.fraunhofer.de/documents/N-173012.html