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Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs

: Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H.


Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 978-1-4244-2814-4
ISBN: 1-4244-2813-0
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Conference Paper
Fraunhofer IZM ()

This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models. The effective thermal material simulation model is investigated for a test matrix of repre-sentative structures. It results in a via structure class-dependent correction factor. As non-destructive failure test the pulse IR thermography using electrical and laser excita-tion was chosen as an analytic method to ob-serve and quantify crack growths in vias. The method shows that cracks are detectable un-ambiguously and its advantage over the ohmic test. The electrical excitation correlates well with the FE-simulation for different crack length in the cylindrical via structure. The laser excitation shows also a good agreement with the FE-simulation and has in contrast to the electrical excitation a good potential for large-scale screening as the board can be stepwise thermally excited and screened in one go with-out having any additional measuring lines. The results were validated with a 3D computer tomography analysis.