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Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications

 
: Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.

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Fulltext urn:nbn:de:0011-n-1730061 (231 KByte PDF)
MD5 Fingerprint: 14accccc8f7423044a650de049566bd2
Created on: 19.12.2013


Vincenzini, P.; Paradiso, R.:
Smart textiles. Proceedings of the focused session A-11 "Smart Textiles" of symposium A "Smart Materials and Micro/Nanosystems". CD-ROM : held as part of CIMTEC 2008 - 3rd International Conference "Smart Materials, Structures and Systems". June 8 - 13, Acireale, Sicily
2008 (Advances in science and technology 60)
ISBN: 3-908158-17-6
ISBN: 978-3-908158-17-2
pp.85-94
Symposium A "Smart Materials & Micro/Nanosystems" - Focused session A-11 <2008, Acireale>
English
Conference Paper, Electronic Publication
Fraunhofer IZM ()

Abstract
This document explains different approaches to integrating electronics in textiles. It discusses reliability standards and tests for electronics in textiles. Encapsulation technologies are evaluated concerning their applicability in textile integrated electronics. Furthermore a specific assembly with embroidered wiring and embroidered interconnections has been developed and improved. Two different encapsulation technologies have been developed for this assembly. Standardized tests have been carried out to assess the reliability of the assembly and its encapsulations. Finally the achievements are critically discussed.

: http://publica.fraunhofer.de/documents/N-173006.html