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Induced delamination of silicon-molding compound interfaces

 
: Schlottig, G.; Pape, H.; Wunderle, B.; Ernst, L.J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 : Delft, Netherlands, 26 - 29 April 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4160-0
ISBN: 978-1-4244-4159-4
Art. 4938478
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <10, 2009, Delft>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed modechisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation. The setup allows for the investigation of interfaces at package scale.

: http://publica.fraunhofer.de/documents/N-172997.html