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Establishing fracture properties of EMC-copper (-oxide) interfaces: Test procedures and simulations for establishing the interface toughness, depending on temperature, humidity and mode mixity

 
: Ernst, L.J.; Xiao, A.; Vreugd, J. de; Jansen, K.M.B.; Pape, H.; Schlottig, G.; Wunderle, B.

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Institute of Electrical and Electronics Engineers -IEEE-; IEEE Vehicular Technology Society -VTS-:
IEEE 70th Vehicular Technology Conference, VTC-Fall 2009 : Anchorage, Alaska, USA, 20 - 23 September 2009
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-4244-2514-3
ISBN: 978-1-4244-2515-0
Art. 5378882
Vehicular Technology Conference (VTC Fall) <70, 2009, Anchorage/Alas.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Interfacial delamination has become one of the key reliability issues in the microelectronics of portable devices and therefore is getting more and more attention. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch in mechanical properties of the materials adjacent to the interface and also possible asymmetry of loading and geometry, usually the delamination propagates under mixed mode conditions. In this study, a modified mixed mode bending test using production line interface samples is proposed. The critical fracture properties are obtained by interpreting the experimental results through dedicated finite element modeling. The interface types being considered in the present work are between EMC's and copper lead frame.

: http://publica.fraunhofer.de/documents/N-172974.html