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Equivalent circuit modeling of signal vias considering their return current paths

: Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.


Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2010 : 12-16 April 2010, Beijing
Piscataway, NJ: IEEE, 2010
ISBN: 978-1-4244-5621-5
Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) <2010, Beijing>
Conference Paper
Fraunhofer IZM ()

A circuit model for signal vias, considering their return-current paths in five-layered stack-ups, is proposed. Closed-form expressions for the computation of via capacitance are derived and used together with conventional formulas for inductance and resistance computations to accurately account for the RF behaviour of the vias over a wide range of frequencies.