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2010
Conference Paper
Titel
Equivalent circuit modeling of signal vias considering their return current paths
Abstract
A circuit model for signal vias, considering their return-current paths in five-layered stack-ups, is proposed. Closed-form expressions for the computation of via capacitance are derived and used together with conventional formulas for inductance and resistance computations to accurately account for the RF behaviour of the vias over a wide range of frequencies.