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Large area embedding for heterogeneous system integration

 
: Braun, T.; Becker, K.-F.; Böttcher, L.; Bauer, J.; Thomas, T.; Koch, M.; Kahle, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bründel, M.; Haag, J.F.; Scholz, U.

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IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-:
60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1 : 1-4 June 2010, Las Vegas, NV, USA
New York, NY: IEEE, 2010
ISBN: 978-1-4244-6411-1
ISBN: 978-1-4244-6410-4
pp.550-556
Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing with potential for low cost applications. Wafer level embedding technologies and embedding of active components into printed circuit boards CChip-in-Polymer) are two major packaging trends in this area. This paper describes the use of compression and transfer molding techniques for multi chip embedding in combination with large area and low cost redistribution technology from printed circuit board manufacturing as adapted for Chip-in-Polymer applications. The work presented is part of the German governmental funded project SmartSense. Embedding by transfer molding is a well known process for component embedding that is widely used for high reliable microelectronics encapsulation. However, due to material flow restrictions transfer molding does not allow large area encapsulation, but offers a cost effecti ve technology for embedding on a medium size scale as known e.g. from MAP Cmolded array packaging) molding Ctypically with sizes up to 60×60 mm2). In contrast, compression molding is a relatively new technology that has been especially developed for large area embedding of single chips but also of multiple chips or heterogeneous systems on wafer scale, typically up to 8" or even up to 12". Wiring of these embedded components is done using PCB manufacturing technologies, i.e. a resin coated copper CRCC) film is laminated over the embedded components - no matter which shape the embedded components areas are: a compression molded wafer, larger rectangular areas or smaller transfer molded systems CMAP). Typical process flow for RCC redistribution is lamination of RCC, via drilling to die pads by laser, galvanic Cu via filling, conductor line and pad formation by Cu etching, soldermask and solderable surface finish application - all of them standard PCB processes. The feasibility of the technology is dem

: http://publica.fraunhofer.de/documents/N-172949.html