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GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects

 
: Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.

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IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-:
60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 3 : 1-4 June 2010, Las Vegas, NV, USA
New York, NY: IEEE, 2010
ISBN: 978-1-4244-6410-4
ISBN: 978-1-4244-6412-8
pp.1647-1652
Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
We introduce thin glass for electrical-optical integration on module level. Glass is regarded as promising material for high frequency wiring to drive the e/o components having additional advantages in terms of transparency, waveguide and lens integration capability and PCB integration. Modeling results of vertical and horizontal electrical interconnects show the suitability for certain configurations. The integration schemes will be discussed and experimental results from thin film deposition, laser drilling of through vias and ion exchange for optical waveguides will be presented.

: http://publica.fraunhofer.de/documents/N-172948.html