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Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation

 
: Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.

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Institute of Electrical and Electronics Engineers -IEEE-:
12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. Vol.1 : Las Vegas, Nevada, USA, 2 - 5 June 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-5342-9 (online)
ISBN: 978-1-4244-5343-6 (print)
pp.1-11
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM) <12, 2010, Las Vegas/Nev.>
English
Conference Paper
Fraunhofer IZM ()

Abstract
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. We have developed both bulk and interface technologies to reduce thermal resistance using Ag and Au-based materials and low-T and low-p processes to render them eligible for the electronics industry. New processes to generate nano-enhanced surface structures as well as thermo-compression bonding are examined within this paper. Along with these processes especially designed test stands are described which are able to extract the effects achieved by the technological advances.

: http://publica.fraunhofer.de/documents/N-172943.html