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Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging

 
: Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.

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Bi, K.:
11th International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2010 : 16 - 19 Aug. 2010, Xi'an, China
Piscataway, NJ: IEEE, 2010
ISBN: 978-1-4244-8142-2 (print)
ISBN: 978-1-4244-8140-8
pp.50-54
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) <11, 2010, Xi'an>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Driving packaging cost down is essential to make products cheaper. There are several options to reduce costs: One is to switch from one packaging technology to another (cheaper) one. The other is to cut costs for an existing process step by using cheaper material and/or a more cost effective process flow. For 3-D-packages dry films can be used as a photo mask for Si dry etching. They do have the capability to bridge over etched cavities or to create 3-D structure. Opportunities provided by the use of dry films will be discussed in the paper.

: http://publica.fraunhofer.de/documents/N-172930.html