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Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices

 
: Hansen, U.; Maus, S.; Leib, J.; Toepper, M.

:

Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
pp.486-490
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
English
Conference Paper
Fraunhofer IZM ()

Abstract
The novel wafer-level packaging (WLP) process invented allows hermetic capping of optical devices on wafer-level yielding miniaturized glass cavity windows on top of the optical area, at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. These optical cavity packages are used within standard chip-on-board (COB) assemblies for high performance optical applications providing high yields and utmost reliability for miniaturized optical devices at low costs.

: http://publica.fraunhofer.de/documents/N-172924.html