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Contactless material deposition by jetting for heterogeneous system integration

 
: Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.

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Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
pp.1061-1062
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
English
Conference Paper
Fraunhofer IZM ()

Abstract
During the last years, jetting processes for higher viscosity materials have gained widespread interest in microelectronics manufacturing. Main reasons for this interest are high throughput/productivity of jetting, contactless material deposition, high volume precision and freely designable deposition patterns. Especially the higher viscosity materials are of interest for the integration of a variety of heterogeneous components as needed for the assembly of System in Package. As knowledge on jetting behavior of these materials is not generally available, a study combining material analysis and process development has been conducted with the aim to demonstrate the limits of jet dispensing for higher viscosity materials.

: http://publica.fraunhofer.de/documents/N-172910.html