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Modeling and analysis of coplanar bonding wires for high-speed applications

 
: Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.

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Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
pp.387-390
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and compared. The impact of the pitch of the bond wires and the distance of separation between the signal wire and a nearby reference plane, on RF performance are quantified for GSM 900/1800, 2.4 GHz/5GHz WLAN and high-speed applications above 10 GHz. Considering a bond wire diameter of 50 m, length of 1mm and pitch of 100 m, it is found that almost 3 times more power is lost through the two-conductor model than coplanar configuration at 10 GHz. This makes the coplanar configuration more suited for high-speed applications.

: http://publica.fraunhofer.de/documents/N-172909.html