Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Local stress measurement methods for packaging purposes- a comparison
| Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
pp.930-933 |
| Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin> |
|
| English |
| Conference Paper |
| Fraunhofer IZM () |
Abstract
The paper gives a brief overview on some advanced stress measurement methods, which permit local access to semiconductor or packaging structures with a micrometer scale spatial resolution. Focusing is made on local stress relief, Raman spectroscopy and EBSD based techniques. The methods are compared with respect to their resolution limits, feasibility to be applied to different materials and their specific limitations.