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2010
Conference Paper
Titel
Local stress measurement methods for packaging purposes- a comparison
Abstract
The paper gives a brief overview on some advanced stress measurement methods, which permit local access to semiconductor or packaging structures with a micrometer scale spatial resolution. Focusing is made on local stress relief, Raman spectroscopy and EBSD based techniques. The methods are compared with respect to their resolution limits, feasibility to be applied to different materials and their specific limitations.