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Embedding of electronic and system in package using generative processes

 
: Ansorge, F.; Heumann, K.; Ifland, D.; Reichl, H.

Silva Bartolo, P.J. da:
Innovative developments in design and manufacturing : 4th International Conference on Advanced research in virtual and rapid prototyping, Proceedings of VR@P4, 6th to 10th Oct. 2009, Leiria, Portugal
Boca Raton, Fla.: CRC Press, 2010
ISBN: 978-0-415-87307-9
ISBN: 0-415-87307-X
pp.301-304
International Conference on Advanced Research in Virtual and Rapid Prototyping (VR@P) <4, 2009, Leiria, Portugal>
English
Conference Paper
Fraunhofer IZM ()

Abstract
In the past few years the use of micro-electronics and micro mechatronics made large progress in medical applications, automation technology as well new systems architectures. New requirements are necessary concerning a high degree of miniaturization and additionally form factors to adopt systems to space given. Especially medical applications are demanding for the use of novel technology and embedding of the systems or subsystems inside a mechanical structure. These novel systems have to include the mechanical part as well as the electronic part in accordance with the definition of mechatronics and micro-mechatronics. In this paper a review is given concerning different methods of embedding of micro-electronics in combination with generative processes. Particularly the issues of assembly and reliability are taken into account. A comparison with conventional processes will highlight the properties of the generative processes. For interconnection issues different process es are necessary. Pros and cons of conductive adhesives versus other methods making tool less structures metallization layers are explained and compared to conventional fabrication processes. Possibilities of sensors integration using generative processes are described. Functional embedded electronics is the second part of the paper. Especially stereolithograpy process will be taken into account. By means of a small functional system a detailed description of the embedding process is given. Interconnects are performed using different methods like conductive adhesive. An explanation of the materials used, the necessary technologies are given in detail. Finally first reliability results will describe the advantages of the new processes. The paper is round up by screening the benefits of the embedding processes of micro electronics for small and medium enterprises.

: http://publica.fraunhofer.de/documents/N-172899.html