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Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

: Brusberg, L.; Lang, G.; Schröder, H.


Glebov, A.L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Optoelectronic Interconnects and Component Integration XI : 24 - 26 January 2011, San Francisco, California, United States
Bellingham, WA: SPIE, 2011 (Proceedings of SPIE 7944)
ISBN: 978-0-8194-8481-9
Paper 79440C
Optoelectronic Interconnects and Component Integration Conference <11, 2011, San Francisco/Calif.>
Conference Paper
Fraunhofer IZM ()

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrate s. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.