Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
| Institute of Electrical and Electronics Engineers -IEEE-:
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 : Linz, Austria, 18 - 20 April 2011
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0107-8
ISBN: 978-1-4577-0106-1
pp.486-492 |
| International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz> |
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| English |
| Conference Paper |
| Fraunhofer IZM () |
Abstract
An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.