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Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

 
: Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.

:

Institute of Electrical and Electronics Engineers -IEEE-:
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 : Linz, Austria, 18 - 20 April 2011
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0107-8
ISBN: 978-1-4577-0106-1
pp.486-492
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>
English
Conference Paper
Fraunhofer IZM ()

Abstract
An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.

: http://publica.fraunhofer.de/documents/N-172880.html