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Modelling of metal degradation in power devices under active cycling conditions

 
: Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.

:

Institute of Electrical and Electronics Engineers -IEEE-:
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 : Linz, Austria, 18 - 20 April 2011
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0107-8
ISBN: 978-1-4577-0106-1
pp.100-105
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>
English
Conference Paper
Fraunhofer IZM ()

Abstract
Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads [1, 2]. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model has to go beyond a simple Coffin-Manson type model to capture the essential influencing parameters.

: http://publica.fraunhofer.de/documents/N-172878.html