Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Laser-shaped thick-film and LTCC microresistors

 
: Mi, E.; Borucki, M.; Dziedzic, A.; Kamiski, S.; Rebenklau, L.; Wolter, K.-J.; Sonntag, F.

:

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.2 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0553-X
pp.957-960
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
English
Conference Paper
Fraunhofer IWS ()

Abstract
The dimensions of discrete passives, passive integrated components (arrays, networks) and embedded integral ones should be reduced significantly in the nearest future. Therefore the relations between technological accuracy and limitations, minimal geometrical dimensions and electrical as well as stability properties become more and more important. This paper presents geometrical, electrical and stability properties of thick-film and LTCC microresistors made by laser shaping method (KrF excimer laser was used for shaping). The geometrical parameters (average width and thickness of conductive and resistive film, width, depth and shape of laser kerf) are correlated with basic electrical properties of resistors (sheet resistance, hot temperature coefficient of resistance, their distribution, resistance versus temperature dependence in a wide temperature range) as well as long-term thermal stability and durability of microresistors to short electrical pulses. The presented r esults indicate that laser shaping can serve as interesting alternative for thick-film and LTCC resistors miniaturization.

: http://publica.fraunhofer.de/documents/N-172745.html