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Application of lock-in thermography for backside failure localization using solid immersion lenses

: Schmidt, C.; Große, C.; Altmann, F.; Schulz, J.; Seibt, A.

Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio:
ISTFA 2010, 36th International Symposium for Testing and Failure Analysis. Conference Proceedings : November 14 - 18, 2010, InterContinental Hotel Dallas, [Addison], Dallas, Texas, USA
Materials Park, Ohio: ASM International, 2010
ISBN: 978-1-615-03041-5
ISBN: 1-615-03041-7
International Symposium for Testing and Failure Analysis (ISTFA) <36, 2010, Dallas/Tex.>
Conference Paper
Fraunhofer IWM ()

In this paper the application of solid immersion lenses (SIL) in combination with Lock-in Thermography will be demonstrated for backside defect localization. The paper will give an introduction into Lock-in Thermography technique and presents a new developed easy-to-use holding system to adapt SIL for high resolution thermal imaging. It will be shown that defect localization can be applied from the backside of the chip up to a silicon thickness of 250m using the same SIL. The relationship between the bulk silicon thickness and the resulting optical parameters was investigated.