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New packaging concepts for highly stable laser diode modules

: Werner, E.; Kretzschmar, S.; Bonati, G.; Eberhardt, R.


Pfleging, W. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based micro- and nanopackaging and assembly III : LBMP-III; 28 - 29 January 2009, San Jose, California, United States; part of LASE 2009, at Photonics West
Bellingham, WA: SPIE, 2009 (Proceedings of SPIE 7202)
ISBN: 978-0-8194-7448-3
Paper 720204
Laser-Based Micro- and Nanopackaging and Assembly Conference <3, 2009, San Jose/Calif.>
Photonics West Conference <2009, San Jose/Calif.>
Conference Paper
Fraunhofer IOF ()

For mounting FAC lenses to diode lasers a new technology is introduced. Solder jet ball bumping is demonstrated to have the potential to replace conventional mounting technologies like adhesive bonding. The advantage of this method is a thermally and mechanically stable connection of micro optics and laser without drawbacks of outgasing and sensitivity to UV. The reached accuracy is within the range of one micrometer.