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Inkjet printing and argon plasma sintering of an electrode pattern on polymer substrates using silver nanoparticle ink

: Pabst, O.; Perelaer, J.; Beckert, E.; Becker, H.; Schubert, U.S.; Eberhardt, R.; Tünnermann, A.

Güttler, S. ; Society for Imaging Science and Technology -IS&T-; Imaging Society of Japan -ISJ-:
Digital Fabrication 2010. NIP 26, 26th International Conference on Digital Printing Technologies. Technical programs and proceedings : September 19 - 23, 2010, Austin, Texas
Springfield/Va.: IS&T, 2010
ISBN: 978-0-89208-292-6
ISBN: 978-0-89208-293-3
International Conference on Digital Printing Technologies (NIP) <26, 2010, Austin/Tex.>
Conference on Digital Fabrication <6, 2010, Austin/Tex.>
Conference Paper
Fraunhofer IOF ()

Inkjet printing and plasma sintering of a silver electrode pattern on polymer substrates for applications in microfluidic systems is presented. The pattern consists of several finger electrodes and contact pads that exhibit lateral dimensions of 30 × 80 mm2 The pitch between neighboring finger electrodes is 270 m and the smallest linewidth of the finger electrodes realized is 90 m. Commercially available silver nanoparticle dispersion is used as ink. The electrode layout is printed onto a cyclic olefin polymer (COP) substrate. Prior to printing the substrate is activated using argon plasma in order to ensure good wetting. The as-printed features are then sintered using argon plasma. This sintering technique enables sintering of the nanoparticles in a selective manner without heating the substrate above its glass transition temperature. Sintering times are in the range of 5 to 15 minutes and the resulting resistivity of the printed features is approximately 57 times the bulk silver value.