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Development of simultaneous laser welding process applied to thermoplastic polymers

 
: Abed, S.; Knapp, W.; Traub, M.; Hoffmann, D.; Poprawe, R.; Loosen, P.

Patel, R.:
Laser Materials Processing Conference, Laser Microfabrication Conference, ICALEO 2004, 23rd International Congress on Applications of Lasers & Electro-Optics. Congress proceedings. CD-ROM : October 4 - 7, 2004, San Francisco Airport Marriott, San Francisco, California, USA
Orlando, Fla.: LIA, 2004 (LIA publication 597 = 97)
ISBN: 0-912035-77-3
ISBN: 978-0-912035-77-2
pp.503
International Congress on Applications of Lasers and Electro Optics (ICALEO) <23, 2004, San Francisco/Calif.>
Laser Materials Processing Conference <2004, San Francisco/Calif.>
Laser Microfabrication Conference <2004, San Francisco/Calif.>
English
Conference Paper
Fraunhofer ILT ()

Abstract
Transmission laser welding of thermoplastic polymers offers innovative solutions to overcome limitations of conventional joining technologies. Different process strategies provide to flexibility, short process time and high quality weld seams. However, even if laser beam welding of thermoplastics becomes widely used in industry, important developments are necessary with regard to the assembly process and the development of specific polymers. Generally, the assembly is done by contour welding or quasi-simultaneous welding (using scanning heads). Simultaneous welding can be another interesting alternative as well the possibility to achieve direct simultaneous welding while using an arrangement of compact and modular set up of power diode laser. This process shows important advantages as the short process time, no dynamic motion system and increased gap bridging capability. Main constraints are the control of the beam intensity distribution and the lack of flexibility conc erning the seam geometry. A specific optical system to allow simultaneous welding using a conventional fibre coupled laser was developed. This beam shaping optic assures an homogeneous intensity distribution and can easily be exchanged when changing the geometry of the seam. An example of electronic packaging using this innovative process is presented in this article.

: http://publica.fraunhofer.de/documents/N-171138.html